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Thermal Compound paste heat sink carbon based high performance temperature cooling Silicone Grease Syringe used as IC CPU GPU vga chipset
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Thermal Compound paste heat sink carbon based high performance temperature cooling Silicone Grease Syringe used as IC CPU GPU vga chipset
Syringe Tube Thermal heatsink compounds Grease silicone paste for CPU IC GPU VGA chipset white Gray
Thermal Compound paste heat sink carbon based high performance temperature cooling Silicone Grease Syringe used as IC CPU GPU vga chipset is available to buy in increments of 1
Powered by the most advanced mobile processors from the new Core 2 Duo MacBook Pro is over 50% faster than the original Core Duo MacBook Pro and now supports up to 4GB.
About Me : Powered by the most advanced mobile processors from the new Core 2 Duo MacBook Pro is over 50% faster than the original Core Duo MacBook Pro and now supports up to 4GB.Composition : 100% POLYESTER Example Shown : SIZE XS, Hem to Hem 84cm OR 33 '
The product has been strictly tested
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Syringe Theraml Heatsink compounds
High thermal conductivity and low thermal resistance, with excellent thermal conductivity;
Low viscosity, with certain thixotropy, low oil separation;
Excellent electrical insulation performance and aging resistance;
Good construction performance, suitable for various construction techniques such as screen printing, dispensing and smearing;
Excellent resistance to high and low temperature range performance, can be used in the environment of -55 ℃ ~ 240 ℃.
12.8W Syringe Theraml Heatsink compounds
color: gray Thermal conductivity W/m·K 12.8 Non-toxic, tasteless, non-corrosive Thermal resistance (40PSI) ℃·cm2/W ＜0.03 Density g/cm3 ＞3.42 Viscosity (25℃) 100Pa·s Cone penetration 1/10mm 300±10 Volatile matter (200℃)% ＜0.02 Oil separation degree (200℃)% ＜0.02 Dielectric strength (AC) Kv/mm ≥6.0 Volume resistivity Ω·cm ＞1013 Working temperature ℃ -60~250 Net Weight: approx. 1.0g Accessory ONLY.
5W Syringe Theraml Heatsink compounds
color: gray Thermal conductivity W/m·K 5 Non-toxic, tasteless, non-corrosive Thermal resistance (40PSI) ℃·cm2/W ＜0.055 Density g/cm3 ＞2.96 Viscosity (25℃) 100Pa·s Cone penetration 1/10mm 300±10 Volatile matter (200℃)% ＜0.08 Oil separation degree (200℃)% ＜0.05 Dielectric strength (AC) Kv/mm ≥6.0 Volume resistivity Ω·cm ＞1013 Working temperature ℃ -55~240 Net Weight: approx. 1.0g Accessory ONLY.
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More Information
Marque de produit
OSGEAR
Product Type
heatsink compounds paste
Numéro de modèle
HEATSKPST-ALL
Condition
Neuf et inutilisé
UPC
768451065381(5W 2G) 768451065404(5W 4G) 768451065398(12.8W 2G) 768451065411(12.8W 4G)
