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Thermal Compound paste heat sink carbon based high performance temperature cooling Silicone Grease Syringe used as IC CPU GPU vga chipset

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Thermal Compound paste heat sink carbon based high performance temperature cooling Silicone Grease Syringe used as IC CPU GPU vga chipset

SKU
HEATSKPST-ALL
Syringe Tube Thermal heatsink compounds Grease silicone paste for CPU IC GPU VGA chipset white Gray
In stock
4,41 €
Thermal Compound paste heat sink carbon based high performance temperature cooling Silicone Grease Syringe used as IC CPU GPU vga chipset is available to buy in increments of 1
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Syringe Theraml Heatsink compounds
High thermal conductivity and low thermal resistance, with excellent thermal conductivity;
Low viscosity, with certain thixotropy, low oil separation;
Excellent electrical insulation performance and aging resistance;
Good construction performance, suitable for various construction techniques such as screen printing,dispensing and smearing;
Excellent resistance to high and low temperature range performance, can be used in the environment of -55 ℃ ~ 240 ℃.
 
12.8w

    12.8W Syringe Theraml Heatsink compounds

  • color: gray
  • Thermal conductivity W/m·K 12.8
  • Non-toxic, tasteless, non-corrosive
  • Thermal resistance (40PSI) ℃·cm2/W <0.03
  • Density g/cm3 >3.42   
  • Viscosity (25℃) 100Pa·s 
  • Cone penetration 1/10mm 300±10
  • Volatile matter (200℃)% <0.02
  • Oil separation degree (200℃)% <0.02
  • Dielectric strength (AC) Kv/mm ≥6.0
  • Volume resistivity Ω·cm >1013
  • Working temperature ℃ -60~250
  • Net Weight: approx. 1.0g         
  • Accessory ONLY.  



5w

   

    5W Syringe Theraml Heatsink compounds

  • color: gray
  • Thermal conductivity W/m·K 5
  • Non-toxic, tasteless, non-corrosive
  • Thermal resistance (40PSI) ℃·cm2/W <0.055
  • Density g/cm3 >2.96
  • Viscosity (25℃) 100Pa·s
  • Cone penetration 1/10mm 300±10
  • Volatile matter (200℃)% <0.08
  • Oil separation degree (200℃)% <0.05
  • Dielectric strength (AC) Kv/mm ≥6.0
  • Volume resistivity Ω·cm >1013
  • Working temperature ℃ -55~240
  • Net Weight: approx. 1.0g 
  • Accessory ONLY.  

RoHS ---- Compliant
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More Information
Marque de produit OSGEAR
Product Type heatsink compounds paste
Numéro de modèle HEATSKPST-ALL
Condition Neuf et inutilisé
UPC 768451065381(5W 2G) 768451065404(5W 4G) 768451065398(12.8W 2G) 768451065411(12.8W 4G)
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